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SEMI 3D3-1123 (technical revision)
8-0698 (Reapproved 0615) - Test Method for Measurement of the Coefficient of Thermal Expansion and Glass Transition Temperature of Leadframe Tape
本安全基準係確保在製造設備運送移動前，雖受制於個別實務情況之限制，仍儘最大可能地執行除污作業。在許多情況下，必須破壞製造設備才能完整進行化學品除污，製造設備轉讓人(transferor)必須將所有殘存之潛在風險清楚告知受讓人(transferee)。
1-1224 (technical revision)
M02400 - SEMI M24 - 鏡面単結晶プレミアムシリコンウェーハの仕様 StdTpc-XML SEMI 3D3-1123 (technical revision)global Silicon Wafer Committee20061121global Audits and Reviews Subcommittee20072www. semi. org20073CD ROM1994200511 150300 mm Referenced SEMI Standards SEMI M1 Specifications for Polished Mono crystalline Silicon Wafers SEMI M18 Guide for Developing Specification Forms for Order Entry of Silicon Wafers SEMI M45 Provisional Specification for 300 mm Wafer Shipping System SEMI M59 Terminology for Silicon Technology
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